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Xiamen Hualian Electronics Co. , Ltd.
SPECIFICATION
DESCRIPTION: RED SUPER BRIGHT LED MODELHFR8053C-30
05926037469 05926037471 E-mail xmhlec@public.xm.fj.cn Website : www.xmhl.com 361006
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RED SUPER BRIGHT LED SPECIFICATION HFR8053C-30 1FEATURES:

Low Drive Current, High Intensity of Light Emission. Fast Response Time , Pulse Driven.

PARAMETER (1) Forward Pulse Current Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature 5 (2) Soldering Heat (5s)
Water Clear Plastic Molding.
SYMBOL IFPM IFM VR PD Topr Tstg Tsol RATING UNIT mA mA V mW
2ABSOLUTE MAXIMUM RATINGS(Ta=25):
100 50 5 150 -25 - +80 -30 - +100 260
(1) Duty1/10 Frequency1KHz (2) 2 mm Up to 2 mm from the body. 3OPTOELECTRIC CHARACTERISTICS(Ta=25):
PARAMETER Forward Voltage Reverse Current Luminous Intensity Peak Wave Length Dominate Wave Length Spectral Line Half Width Viewing Angle
2002 6
SYMBOL VF IR IV P D 21/2
TEST CONDITION IF=20mA VR=5V IF=20mA IF=20mA IF=20mA IF=20mA IF=20mA
MIN TYP MAX
UNIT V A mcd nm nm nm
2500 -
2.0 638 628 20 15
2.5 10 -
2 7
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RED SUPER BRIGHT LED SPECIFICATION HFR8053C-30
4DIMENSION
5.80.2
5.00.1
8.70.2
MIN26.0
0.5
MIN1.0
2
1
2.54
1. Anode 2. Cathode
1. Anode 2. Cathode
0.2mm
2002 6
0.5
3 7
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6
RED SUPER BRIGHT LED SPECIFICATION HFR8053C-30 Packing
6.1 220x110mm2 500 / Internally packed with 220x110mm2 plastic bag anti-statically, 500pcs/bag.
110
40
40
220
CAUTION TO ELECTROSTATIC DAMAGE XIAMEN HUALIAN
ELECTRONICS C O.LTD. MA DE IN CHINA
6.2 (220x220x190mm)3 10000 / Externally Packed with 220x220x190mm3 cartons, 10000 pcs/carton.
6.3 Label
P/N: Lot No. Qty. Insp.
Xiamen Hualian Electronics Co.., Ltd.
7 Precautions 7.1 Forming 1Leads should be formed before soldering.
2002 6 4 7
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6

RED SUPER BRIGHT LED SPECIFICATION HFR8053C-30
2Do not form the leads with their bases as a fulcrum. 3 5mm Forming location should be up to 5mm from the epoxy body. 7.2 Installation LED PCB Installation on PCB do not apply physical stress to the leads when mounting LED lamps on PCB.
Correct 7.3 Soldering
Wrong
1Do not dip epoxy body into solder bath. 2Do not apply stress to the leads while they are heated. 3 30W 3 When soldering LED, the solder iron power should be not more than 30W and with the soldering time not more than 3 seconds. 9.4 Cleaning 1 1 In any case, the cleaning time should be 1 minute or less at a normal temperature. 2 Do not clean LEDs with water as the remains may rust the leads. Alcohol is suggested to be used. 3 LED 300W 30 PCB LED PCB LED When LEDs are ultrasonic-washed, use the ultrasonic output power of less than 300W and the time of less than 30s; do not let the PCB and LEDs touch on the oscillator; do not resonate the LEDs attached on the PCB. 7.5 LED LED
2002 6 5 7
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RED SUPER BRIGHT LED SPECIFICATION HFR8053C-30
The ultra bright LED is an electrostatic insensitive device, so static electricity and surge will damage the LED. It is required to wear a wrist-band when handling the LED. All device, equipment, machinery, desk and ground must be properly grounded. 8 Suggested way of usage.
LED 20mA When using LED, it must use a protective resistor in series with DC current about 20 mA.
2002 6
6 7
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